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March 04, 2026,Barcelona, Spain – At Mobile World Congress 2026, MediaTek unveiled its “AI For Life: From Edge to Cloud” showcase, featuring the keynote presentation by Joe Chen -President ofMediaTek and an interactive booth experience. The exhibit highlights breakthroughs in 6G communications, 5G-Advanced customer premises equipment (CPE) with Wi-Fi 8, edge AI applications in smartphones and IoT devices, advanced automotive connectivity, and next-generation data center technologies. Together, these innovations reinforce MediaTek’s leadership in building intelligent, seamlessly connected ecosystems powered by advanced silicon and AI.
At the “AI For Life: From Edge to Cloud” keynote on March 4 in Hall 8, Weizhi Yu-VP of Automotive Product Marketing of MediaTek and Will Chen-VP Wireless Business Group take the stage alongside key industry partners to spotlight collaborative efforts driving the company’s vision for the future of mobile, automotive and AI innovation.
“This week, we’re showcasing a broad range of industry-leading breakthrough technologies, with a strong emphasis on enabling advanced AI from edge to cloud, alongside cutting-edge connectivity solutions for our customers,” said Joe Chen- President of MediaTek. “Our innovations are paving the way for exciting new products, devices and standards — all designed to transform everyday life for individuals and businesses around the world.”
Advancing 6G with Integrated AI
A key focus of MediaTek’s presence at MWC 2026 is its continued leadership in 6G development. As an active contributor to emerging 6G standards, the company is demonstrating what it describes as the world’s first 6G radio interoperability — enabling dynamic optimisation of throughput, latency and power efficiency. This capability lays the foundation for supporting next-generation generative and agentic AI services.
MediaTek is also introducing its vision of a “personal device cloud,” where AI agents collaborate seamlessly across personal and household devices via Wi-Fi or 6G networks within a secure, uninterrupted computing environment.
Among the featured technologies is AI-accelerated uplink transmit diversity (TxD) for 6G. By learning and adapting dynamically to real-time network conditions, this approach significantly enhances performance compared to traditional rule-based systems.
The company will further demonstrate how 6G can empower next-generation robotics, leveraging edge computing to deliver responsive, compute-intensive performance on demand — opening new possibilities for intelligent automation across industries.
Integrated Effective AI into 6G Connectivity
At the forefront of MediaTek’s MWC 2026 showcase is its ongoing leadership in 6G technology development. As a proactive driver of 6G standards, MediaTek is demonstrating the world’s first 6G radio interoperability, enabling unprecedented flexibility in balancing throughput, latency, and power optimization, and providing the backbone to support emerging generative and agentic AI services.
The company is outlining its vision for a “personal device cloud,” in which AI agents seamlessly collaborate across personal and family devices over Wi-Fi or 6G networks within a secure and uninterrupted computing environment.
MediaTek will present AI-accelerated uplink transmit diversity (TxD) for 6G, which dynamically learns and adapts to network conditions to significantly improve performance compared to traditional rule-based approaches.
Additionally, MediaTek will highlight how 6G will enable next-generation robotics by leveraging edge computing services to deliver responsive, compute-intensive application performance on demand.
Next-Generation 5G-Advanced CPE with Wi-Fi 8
MediaTek will showcase the world’s first 5G-Advanced CPE device with Wi-Fi 8, powered by the MediaTek T930 and Filogic 8000 series chipsets, respectively. The device integrates the latest 3GPP Release 18 standard modem and introduces multiple industry-first capabilities, including eight receive antennas that improve spectrum efficiency by over 40%, and the world’s first three transmit antennas with five MIMO layers, boosting uplink throughput by 40%.
The MediaTek AI network engine integrates AI L4S and AI QoS, making it the industry’s first to deliver up to 10x lower latency for both L4S-capable applications and legacy apps, across uplink and downlink, from the CPE edge. It uniquely combines standards-based L4S acceleration with an AI-driven QoS engine that recognizes application pattern and requires no changes to core, transport, or application backends.
Expanding Automotive Connectivity and Intelligent Cockpits
MediaTek is demonstrating the world’s first 5G NR NTN video call in automotive communications, marking a significant milestone in satellite-based connectivity. NR NTN enables high-speed satellite communications capable of supporting video streaming, app usage, and internet access beyond traditional terrestrial coverage.
The company is also introducing a new telematics chipset which supports 5G-Advanced Release 17 and Release 18 standards and features an integrated modem-level AI to enhance connection stability and performance.
Inside the vehicle, MediaTek presents a new Dimensity Auto smart cockpit platform built on a 3-nanometer automotive-grade process. The platform features a high-performance multi-core CPU based on Arm v9.2 architecture, advanced GPU capabilities that support media streaming and console-level gaming with ray tracing, and a powerful NPU designed to enable generative AI voice assistants while maintaining strong data privacy.
AI-Powered Mobile Innovation
As the worldwide industry-leading provider of flagship smartphone SoCs, MediaTek is leveraging its innovative Dimensity 9500 mobile platform to enable advanced edge AI experiences through its integrated NPU, ensuring highly responsive, private, and secure on-device processing.
MediaTek will also unveil AI glasses that deliver true end-to-end, on-device AI collaboration with smartphones, with instant response and privacy. Powered by Dimensity 9500’s advanced NPU, the glasses utilize the powerful Omni multimodal large model, enabling seamless interaction through text, image, speech, and video.
Ultra-Low Power, High-Bandwidth Interconnect for Data Centers
As a leader in the data center solutions industry, MediaTek is expanding its leadership and unveiling a newly developed in-house UCIe-Advanced IP for die-to-die connectivity, the world’s first silicon-validated on TSMC’s advanced 2nm and 3nm process technologies. The solution supports advanced packaging methods such as silicon interposers and bridges, featuring ultra-low bit-error-rate,
ultra-low power consumption, and high bandwidth densities reaching up to 10 terabits per second per millimeter of die edge.
MediaTek is also demonstrating its in-house co-packaged optics solution, designed to overcome the limitations of traditional copper interconnects. The technology establishes a pathway toward bandwidth speeds of up to 400 gigabits per second per fiber, while significantly improving energy efficiency and system integration. This is supported by fully integrated electrical, optical, thermal, and mechanical design, along with a robust supply chain ecosystem.
These new solutions will maximize performance per watt and performance per total cost of ownership (TCO) in data centers. By co-optimizing the entire system, MediaTek turns data centers into a strategic asset rather than a limitation. The critical metrics are no longer raw TOPS, but tokens per watt and tokens per dollar at the rack level, ensuring customers get the most useful work out of every joule consumed and every dollar spent.
Demos in IoT, high-performance compute, and Chromebook
At the MWC booth, MediaTek will highlight high-performance compute capabilities on the NVIDIA DGX Spark, which features the NVIDIA GB10 Grace Blackwell Superchip co-designed by MediaTek. The company’s latest developments in IoT, such as the world’s first AI interpreter hub, will be on display; and attendees can check out the on-device AI capabilities for Chromebook, powered by the MediaTek Kompanio Ultra.
